Electronic assembly, notably configured to be integrated in an inverter

Electronic assembly comprising:

• a first cooling device comprising a first thermal contact face,
• a second cooling device comprising a second thermal contact face and a bearing face,
• at least one power electronics module having a first face and a second face, in particular parallel to one another, the first face of the power electronics module being in thermal contact with the first thermal contact face of the first cooling device and the second face of the power electronics module being in thermal contact with the second thermal contact face of the second cooling device,
• a retention structure placed in contact with the bearing face of the second cooling device, and comprising at least one elastic portion,
• a plurality of attachment elements,
• wherein:
• the first cooling device and the elastic portion of the retention structure each comprise a plurality of attachment holes,
• the plurality of attachment elements passes through the attachment holes and exerts a force on the retention structure, causing deformation of the elastic portions of the retention structure, this deformation giving rise to clamping loads on the bearing face of the second cooling device, these clamping loads being sufficient to rigidly secure together the first cooling device, the second cooling device and the retention structure.