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US 12,642,092 B2Granted
Chip package with decoupled thermal management
AssigneeXilinx, Inc.
InventorsGamal Refai-Ahmed, Yohan Frans, Suresh Ramalingam
Life of this patent
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Abstract
Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.
Claims16
An electronic device comprising:
- a package substrate;
- a stiffener mounted to the package substrate;
- a first IC die having a first surface and a second surface facing away from the first surface, the second surface of the first IC die facing the package substrate;
- a second IC die having a first surface and a second surface, the second surface of the second IC die facing the package substrate;
- a first heat spreader having a first surface and a second surface, the first surface of the first heat spreader having a die contact region configured for contacting the first surface of the first IC die, first heat spreader having an opening;
- a second heat spreader having a first surface and a second surface, the second heat spreader movably disposed in the opening of the first heat spreader, the second heat spreader spaced from the first heat spreader by a gap defining a portion of the opening;
- and
- a flexible heat pipe in thermal contact with the first heat spreader and the second heat spreader, the heat pipe movable with the second heat spreader relative to the first heat spreader, the heat pipe having a phase change material disposed therein.
5 more elements
Dependencies are inferred from the claim text.