Methods and apparatus to protect integrated circuit packages and their interconnects from shock loads
AssigneeIntel Corporation
InventorsGuebum Han, Eric W. Buddrius, Emery Evon Frey, Jeffory L. Smalley, Ralph V. Miele
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Abstract
Systems, apparatus, articles of manufacture, and methods to protect integrated circuit packages and their interconnects from shock loads are disclosed. An example apparatus includes a heatsink, and a spring-loaded fastener to urge the heatsink against an integrated circuit package. The integrated circuit package is coupled to a circuit board. The integrated circuit package is between the heatsink and the circuit board. The example apparatus includes a lock to restrain movement of the heatsink relative to the circuit board independent of the spring-loaded fastener.
Claims20
An apparatus comprising:
- a heatsink;
- a spring-loaded fastener to urge the heatsink against an integrated circuit package, the integrated circuit package to be coupled to a circuit board, the integrated circuit package to be between the heatsink and the circuit board;
- and
- a lock to restrain movement of the heatsink relative to the circuit board independent of the spring-loaded fastener.
An apparatus comprising:
- an integrated circuit package on a first side of a circuit board;
- a backplate on a second side of the circuit board opposite the first side;
- a heatsink thermally coupled to the integrated circuit package, the integrated circuit package between the heatsink and the circuit board;
- spring-loaded fasteners to urge the backplate and the heatsink towards each other to place the integrated circuit package in compression;
- and
- a lock to secure the heatsink in fixed spatial relationship to the integrated circuit package, the lock distinct from the spring-loaded fasteners.
An apparatus comprising:
- an integrated circuit package;
- means for cooling the integrated circuit package;
- means for urging the means for cooling towards the integrated circuit package;
- and
- means for locking the means for cooling in place relative to the integrated circuit package, the means for locking different from the means for urging.
Dependencies are inferred from the claim text.