Electronic package with a thermal interposer and method of manufacturing the same
AssigneeInternational Business Machines Corporation
InventorsSri M. Sri-Jayantha, Gerard McVicker, John U. Knickerbocker
Life of this patent
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Abstract
An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
Claims25
An electronic package, comprising:
- a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
- an organic substrate;
- a thermal interposer provided between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die, said thermal interposer conducting heat generated by said die through said thermal interface material of said die and said area;
- and
- a device layer formed between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer.
An electronic package, comprising:
- a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
- an organic substrate;
- a thermal interposer provided between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die;
- a device layer formed between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer;
- and
- an augmenting element formed on said thermal interface material of said area,
- wherein said thermal interposer conducts heat generated by said die through said thermal interface material of said die and said area and said augmenting element.
An electronic package, comprising:
- a plurality of dies stacked three-dimensionally through which a primary heat flux path is enabled for conducting heat from said plurality of dies;
- an organic substrate;
- and
- a thermal interposer provided between said organic substrate and said plurality of dies, said thermal interposer having an area extending beyond a footprint of said plurality of dies, said thermal interposer comprising:
- a thermal piston formed on a thermal interface material provided on a first portion of said area, said piston comprising highly conductive material;
- and
- a plurality of molded portions provided on a second portion of said area, said plurality of molded portions surrounding said piston,
- wherein said thermal interposer conducts heat generated by said plurality of dies through said thermal interface material and said thermal pistons such that an auxiliary heat flux path for conducting heat generated in said plurality of dies is enabled.
A method of manufacturing an electronic package, comprising:
- forming a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
- forming an organic substrate;
- forming a thermal interposer between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die, said thermal interposer conducting heat generated by said die through said thermal interface material of said die and said area;
- and,
- forming a device layer between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer.
Dependencies are inferred from the claim text.