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US 2026/0313849 A1Published application
Multilayer back plate with molded ceramic layer
AssigneeIntel Corporation
InventorsPhil GENG, Ralph V. MIELE, David SHIA
Life of this patent
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Abstract
A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.
Claims20
An apparatus comprising:
- a molded ceramic layer, wherein the molded ceramic layer is comprised of a ceramic material, wherein the molded ceramic layer comprises voids that are capable of accepting a fixturing device therethrough, wherein the fixturing device is capable of securing a bolster plate to a back plate on a printed circuit board, and wherein the molded ceramic layer also comprises an opening into which a backside component of the printed circuit board is capable of being at least partially inserted into;
- and
- a first layer of material that is comprised of a first material that is different from the material of the molded ceramic layer and wherein the first layer of material is on a first surface of the molded ceramic layer.
An assembly comprising:
- a semiconductor chip package comprising one or more semiconductor chips wherein the semiconductor chip package comprises first input/output (I/O) structures;
- a circuit board wherein the circuit board comprises second I/O structures coupled to the first I/O structures;
- a bolster plate on a first surface of the circuit board;
- and
- a back plate comprising a molded ceramic material, wherein the back plate is on a second surface of the circuit board, wherein the molded ceramic material comprises molded openings through which a fixturing device secures the back plate to the bolster plate, wherein the back plate also comprises a molded opening aligned with a component on the circuit board.
2 more elements
Dependencies are inferred from the claim text.