Methods and apparatus to apply load to a socketed integrated circuit package independent of a heatsink loading mechanism

Abstract

Systems, apparatus, articles of manufacture, and methods to apply load to a socketed integrated circuit package independent of a heatsink loading mechanism are disclosed. An example apparatus includes a load plate to interface with an integrated circuit package along a perimeter of the integrated circuit package while permitting a heatsink to interface with a central region of the integrated circuit package; and a torsion spring carried by the load plate. The torsion spring is on a first surface of the load plate. The integrated circuit package engages a second surface of the load plate, the second surface opposite the first surface. The torsion spring urges the load plate toward the integrated circuit package to provide a load to urge the integrated circuit package toward a socket on a circuit board.

Dependencies are inferred from the claim text.