Direct chip connection using demountable flip chip package
OwnerRajendra D. Pendseinventor
Life of this patent
Estimating the term…
Abstract
The present invention provides an easily reworkable demountable means of electrically interconnecting an integrated circuit die to a substrate. The electrical assembly is comprised of an integrated circuit die having contact areas on a first surface, a substrate having contact areas aligned with the contact areas of the die for providing electrical connection to the integrated circuit die, and a compression means for maintaining the integrated circuit die contacts in electrical communication with the contacts of the substrate. The compression means typically includes a two-part spring system which provides superior electrical contact by causing the curvature of the integrated circuit die to be in the same direction as the curvature of the substrate.
Claims15
An electrical interconnection assembly comprising:
- an interconnect substrate having a first major surface and a second major surface;
- an integrated circuit die having a first major surface and a second major surface, wherein the second major surface is the active side of the integrated circuit die, the second major surface of the integrated circuit die having a plurality of contact areas;
- a die attach structure spaced away from the interconnect substrate, the interconnect substrate having a first major surface and a second major surface, wherein the first major surface of the integrated circuit die is coupled to the die attach structure and the second major surface of the integrated circuit die is electrically coupled to the first major surface of the interconnect substrate;
- and
- a compression means for urging the first major surface of the interconnect substrate towards the second major surface of the integrated circuit die, the compression means applying a first force resulting in a curvature of the integrated circuit die in a first direction, the compression means further including a spring system, wherein the spring system results in a curvature of the substrate in the first direction.
A method of forming an electrical interconnection assembly including the steps of:
- mounting an integrated circuit die having a first and second major surface to a die attach structure having a first and second major surface, the second major surface of the integrated circuit die being the active side of the integrated circuit die, the second major surface of the integrated circuit die having a plurality of contact areas;
- aligning the integrated circuit die with a substrate having a first and second major surface, the first major surface of the substrate including a plurality of contact areas corresponding to the plurality of contact areas on the second major surface of the integrated circuit die, the integrated circuit die aligned with the substrate such that the plurality of contact areas on the integrated circuit die are electrically coupled to the plurality of contact areas on the substrate;
- and
- applying forces to compress the first major surface of the substrate towards the second major surface of the integrated circuit die, including a first force results in a curvature of the integrated circuit die in a first direction and a second force applied by a spring system results in a curvature of the substrate in the first direction.
Dependencies are inferred from the claim text.