H10W 40/611
Bolts or screws
Official title: {Bolts or screws}
H10W40/611 (Bolts or screws) appears on 2,116 US grants and 2,362 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,116
- Published applications
- 2,362
- Assignees
- 711
- Inventors
- 4,607
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 9 | 0 |
| 1978 | 14 | 0 |
| 1979 | 7 | 0 |
| 1980 | 6 | 0 |
| 1981 | 9 | 0 |
| 1982 | 7 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 12 | 0 |
| 1986 | 15 | 0 |
| 1987 | 22 | 0 |
| 1988 | 8 | 0 |
| 1989 | 12 | 0 |
| 1990 | 6 | 0 |
| 1991 | 14 | 0 |
| 1992 | 13 | 0 |
| 1993 | 14 | 0 |
| 1994 | 16 | 0 |
| 1995 | 16 | 0 |
| 1996 | 14 | 0 |
| 1997 | 20 | 0 |
| 1998 | 30 | 0 |
| 1999 | 28 | 0 |
| 2000 | 27 | 0 |
| 2001 | 28 | 6 |
| 2002 | 36 | 22 |
| 2003 | 35 | 25 |
| 2004 | 31 | 59 |
| 2005 | 31 | 55 |
| 2006 | 38 | 76 |
| 2007 | 51 | 81 |
| 2008 | 59 | 79 |
| 2009 | 67 | 91 |
| 2010 | 63 | 96 |
| 2011 | 49 | 82 |
| 2012 | 52 | 60 |
| 2013 | 48 | 89 |
| 2014 | 50 | 107 |
| 2015 | 63 | 90 |
| 2016 | 74 | 96 |
| 2017 | 86 | 82 |
| 2018 | 90 | 98 |
| 2019 | 95 | 111 |
| 2020 | 102 | 134 |
| 2021 | 106 | 139 |
| 2022 | 93 | 129 |
| 2023 | 105 | 160 |
| 2024 | 124 | 190 |
| 2025 | 135 | 112 |
| 2026 | 62 | 93 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High voltage distribution box with heat sink6 Oct 2026US 12,756,162 B2Sumitomo Wiring Systems, Ltd.
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Electronic package module25 Aug 2026US 12,721,169 B2Acer Incorporated
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Power module with heat sink and cooling jacket1 Oct 2026US 2026/0304714 A1STMicroelectronics International N. V.
- Semiconductor structure including a guard ring and methods for forming the same17 Sep 2026US 2026/0282918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
- Semiconductor device10 Sep 2026US 2026/0271712 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Heat sink for cooling a heat producing element and application411US 5,504,650 AFujitsu Limited · 1996
- Cooling cover for RF power devices341US 5,428,504 AMotorola, Inc. · 1995
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Method of packaging and powering integrated circuit chips and the chip assembly formed thereby175US 4,954,878 ADigital Equipment Corporation · 1990