H10W 40/613
For stacked arrangements of a plurality of semiconductor devices
Official title: {for stacked arrangements of a plurality of semiconductor devices}
H10W40/613 (For stacked arrangements of a plurality of semiconductor devices) appears on 179 US grants and 197 published applications in this corpus.
Search patents in H10W- Granted patents
- 179
- Published applications
- 197
- Assignees
- 90
- Inventors
- 469
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 4 |
| 2010 | 2 | 2 |
| 2011 | 4 | 7 |
| 2012 | 2 | 6 |
| 2013 | 6 | 4 |
| 2014 | 4 | 8 |
| 2015 | 6 | 10 |
| 2016 | 9 | 16 |
| 2017 | 15 | 18 |
| 2018 | 17 | 21 |
| 2019 | 19 | 21 |
| 2020 | 24 | 15 |
| 2021 | 15 | 13 |
| 2022 | 2 | 7 |
| 2023 | 15 | 11 |
| 2024 | 9 | 11 |
| 2025 | 8 | 9 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High voltage distribution box with heat sink6 Oct 2026US 12,756,162 B2Sumitomo Wiring Systems, Ltd.
- Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector4 Aug 2026US 12,702,062 B2Intel Corporation
- Submodule and associated module, tower, power converter, and power system9 Jun 2026US 12,651,975 B2GE Energy Power Conversion Technology Limited
- Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking9 Jun 2026US 12,653,029 B2United Silicon Carbide, Inc.
- Power control apparatus9 Jun 2026US 12,653,055 B2Denso Corporation
- Semiconductor device and method of making the same13 Aug 2026US 2026/0240041 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the same23 Jul 2026US 2026/0215264 A1Koolmicro Inc.
- Semiconductor package and methods of forming and using the same9 Jul 2026US 2026/0198318 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and power converter11 Jun 2026US 2026/0165121 A1Denso Corporation
- Camm module retention for compressive mount connector and heatsink30 Apr 2026US 2026/0123425 A1Intel Corporation
Most cited
By later US patents
- Stacked busbar assembly with integrated cooling58US 7,952,875 B2GM Global Technology Operations LLC · 2011
- Cooling system for multiwafer high density circuit32US 4,283,754 ABunker Ramo Corporation · 1981
- Electric power converter and mounting structure of semiconductor device32US 7,508,668 B2Denso Corporation · 2009
- Heat dissipating assembly with thermal plates31US 6,603,665 B1Hon Hai Precision Ind.Co., Ltd. · 2003
- Cooling element and connector for an electronic power component cooled by a fluid electrically isolated from the component28US 5,636,684 AAtherm · 1997