Submodule and associated module, tower, power converter, and power system

A submodule for a power converter, comprising,

• a first and a second power storage devices and
• a first stack of electronic device packages, the first stack comprising a first, a second, a third, and a fourth electronic device packages, a first and a second end contact surfaces, and a first and a second terminals, wherein:
• each electronic device package comprises an upper contact surface, a lower contact surface, and a controlled switch configured to control a current flowing between the upper contact surface and the lower contact surface of the said electronic device package,
• the second electronic device package is sandwiched between the first and the third device packages, and the third electronic device package is sandwiched between the second and the fourth electronic device packages so that the upper contact surface of an electronic device package is operatively in contact with the lower contact surface of another electronic device package,
• one contact surface of the upper and lower contact surfaces of the first electronic device package is operatively in contact with the second electronic device package, and the other contact surface of the upper and lower contact surfaces of the first electronic device package is the first end contact surface of the first stack, the first end contact surface being operatively in connected with a first end of the first power storage device, the first and second electronic device packages being operatively in contact with the first terminal,
• one contact surface of the upper and lower contact surfaces of the fourth electronic device package is operatively in contact with the third electronic device package, and the other contact surface of the upper and lower contact surfaces of the fourth electronic device package is the second end contact surface of the first stack, the second end contact surface being operatively in contact with a first end of the second power storage device, the third and fourth electronic device packages being operatively in contact with the second terminal,
• the surface of the upper and lower contact surfaces of the second electronic device package operatively in contact with the third electronic device package is further operatively in contact with the second end of the first and the second power storage devices,
• wherein the first power storage device and the first and second electronic device packages form a first half-bridge converter, and the second power storage device and the third and fourth electronic device packages form a second half-bridge converter within the same submodule, the two half-bridge converters being structurally integrated by the stacked arrangement,
• wherein each power storage device comprises a housing, the housing being connected to the second end of the power device.