Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking
AssigneeUnited Silicon Carbide, Inc.
InventorKe Zhu
Life of this patent
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Abstract
This disclosure relates to a cooling apparatus and a method for cooling semiconductor devices, wherein the cooling apparatus is disposed over a top surface and a bottom surface of a printed circuit board. The disclosed cooling apparatus comprises a printed circuit board, a first semiconductor device comprising a first thermal pad and mounted on a top surface of the printed circuit, a second semiconductor device comprising a second thermal pad and mounted on a bottom surface of the printed circuit, a first heat sink, a first thermal interface structure thermally coupled between the first thermal pad and the first heat sink, a second heat sink, and a second thermal interface structure thermally coupled between the second thermal pad and the second heat sink.
Claims34
A cooling apparatus comprising:
- a printed circuit board;
- a first semiconductor device mounted on a top surface of the printed circuit board, the first semiconductor device including a first semiconductor die encapsulated in a first device package and a first thermal pad forming a top side of the first device package;
- a second semiconductor device mounted on a bottom surface of the printed circuit board, the second semiconductor device including a second semiconductor die encapsulated in a second device package and a second thermal pad forming a top side of the second device package;
- a first heat sink;
- a first thermal interface structure thermally coupled between the first thermal pad and the first heat sink;
- a second heat sink;
- and
- a second thermal interface structure thermally coupled between the second thermal pad and the second heat sink;
- and
- wherein the second semiconductor device and second thermal interface structure are arranged on a bottom side of the printed circuit board in a respectively symmetric manner relative to the first semiconductor device and the first thermal interface structure arranged on a top side of the printed circuit board.
A method for cooling semiconductor devices comprising:
- providing a printed circuit board having a top surface and a bottom surface;
- providing a first semiconductor device mounted on the top surface, the first semiconductor device including a first semiconductor die encapsulated in a first device package and a first thermal pad forming a top side of the first device package;
- providing a second semiconductor device mounted on the bottom surface, the second semiconductor device including a second semiconductor die encapsulated in a second device package and a second thermal pad forming a top side of the second device package;
- providing a first thermal interface structure thermally coupled to the first thermal pad;
- providing a second thermal interface structure thermally coupled to the second thermal pad;
- and
- wherein the second semiconductor device and second thermal interface structure are arranged on a bottom side of the printed circuit board in a respectively symmetric manner relative to the first semiconductor device and the first thermal interface structure arranged on a top side of the printed circuit board.
Dependencies are inferred from the claim text.