Electric power converter and mounting structure of semiconductor device

An electric power converter comprising:

• a main circuit section having a semiconductor module and a cooling device, wherein the semiconductor module constitutes a part of an electric power converter circuit, and wherein the cooling device cools the semiconductor module;
• a control circuit substrate section having a control circuit electrically connected to a signal terminal of the semiconductor module and controlling the semiconductor module;
• and
• a power wiring section connected to a main electrode terminal of the semiconductor module and inputting/outputting current to the semiconductor module, wherein:
• the main circuit section is disposed between the control circuit substrate section and the power wiring section,
• the semiconductor module includes a module main body portion, the main electrode terminal and the signal terminal, and the module main body portion accommodates a semiconductor element therein, the main electrode terminal protruding from the module main body portion, and the signal terminal protruding toward a direction opposite to a protruding direction of the main electrode terminal by almost 180 degrees,
• the cooling device includes a pair of refrigerant tubes arranged to sandwich the module main body portion from both sides thereof, the cooling device cooling the module main body portion from both sides thereof by flowing cooling medium inside of the refrigerant tubes, and
• the semiconductor module is disposed in such a manner that the main electrode terminal and the signal terminal protrude toward opposite directions almost perpendicular to a longitudinal direction of a pair of the refrigerant tubes.