Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector

A memory on package (MOP), comprising:

• a first substrate having one or more of a Central Processing Unit (CPU), System on a Chip (SoC) and other processing unit (XPU) mounted to a topside thereof and including one or more first arrays of compression mount technology (CMT) contacts pads disposed on the topside having and means for coupling signals for at least one or the CPU, SoC, and XPU to the one or more first arrays of CMT contact pads;
• a Compression Attached Memory Module (CAMM) comprising,
• a second substrate including a one or more second arrays of compression mount technology (CMT) contact pads disposed on a first side, plurality of first signal coupling arrays comprising first arrays of signal coupling means disposed on the first side of the second substate and including wiring connecting CMT contact pads to signal coupling means in the plurality of first signal coupling arrays;
• and
• multiple memory chips or packages, each comprising a second signal coupling array comprising a second array of signal coupling means, wherein the signal coupling means in the second signal coupling array for a given memory chip or package are coupled to signal coupling means in a respective first signal coupling array on the second substrate;
• and
• a CMT connector disposed between the first substrate and the second substrate, wherein the CMT connector includes an array of spring-loaded contacts or pins in contact with CMT contact pads in the one or more first arrays and one or more second arrays of CMT contact pads.