Semiconductor package and method of manufacturing the same

Abstract

An embodiment of the present disclosure provides a semiconductor package, in which a plurality of semiconductor chips having different heights are mounted, the semiconductor package including a fluid flow structure bonded directly to a first semiconductor chip among the plurality of semiconductor chips and formed to allow a fluid to flow therethrough, in which a second semiconductor chip, which is greater in thickness than the first semiconductor chip among the plurality of semiconductor chips, is mounted on the semiconductor package. According to the semiconductor package and the method of manufacturing the same according to the embodiment of the present disclosure, it is possible to simultaneously and efficiently cool the plurality of semiconductor chips formed on the semiconductor package and having different heights.

Dependencies are inferred from the claim text.