Heat dissipating assembly with thermal plates

In combination, a circuit board with at least one electronic component mounted thereon, and a heat dissipating assembly comprising:

• a first thermal plate attached on the circuit board, the first thermal plate comprising at least one offset portion thermally connecting the at least one electronic component for dissipating heat therefrom, the first thermal plate defining a first hole in a central portion thereof, and a plurality of second holes in corners thereof;
• a second thermal plate cooperating with the first thermal plate to sandwich the circuit board therebetween, the second thermal plate defining a third hole corresponding to the first hole of the first thermal plate, and a plurality of fourth holes corresponding to the second holes of the first thermal plate;
• an adjusting screw extending through the first hole and movably engaging in the third hole for facilitating thermal contact between the at least one electronic component and the at least one offset portion of the thermal plate;
• and
• a plurality of fastening screws extending through the second holes and engaging in the fourth holes thereby securing the thermal plates to the circuit board.

A heat dissipating assembly comprising:

• a printed circuit board with a heat generating device thereon, said printed circuit board defining opposite first and second surfaces thereon;
• a first thermal plate disposed on the first surface and defining an offset portion in compliance with a contour of said heat-generating device to compliantly receive the heat-generating device therein;
• a plurality of fastening devices positioned on peripheries of the printed circuit board and the first thermal plate to fasten the printed circuit board and the first thermal plate together;
• and
• an adjustment device located around inner portions of said printed circuit board and said first thermal plate to adjustably have the offset portion and the heat-generating device abut against each other.