Cooling system for multiwafer high density circuit

A high density arrangement of integrated circuit devices comprising:

• a multiplicity of wafers lying parallel to one another and electrically interconnected;
• a plurality of integrated circuit devices mounted on certain of said wafers;
• means clamping said wafers into a tight stack;
• said stack including a plurality of spaced heat transfer wafers having overhanging edge portions extending beyond other wafers in said stack along a predetermined side thereof;
• and
• conduit means secured relative to said stack for transporting a fluid past said overhanging edge portions in closely thermally coupled relationship therewith;
• said conduit means having a plurality of fins interleaved with said overhanging edge portions and thermally coupled thereto.

A high density arrangement of integrated circuit devices comprising:

• a multiplicity of wafers lying parallel to one another and electrically interconnected;
• a plurality of integrated circuit devices mounted on certain of said wafers;
• means clamping said wafers into a tight stack;
• said stack including a plurality of spaced heat transfer wafers having overhanging edge portions extending beyond other wafers in said stack along a predetermined side thereof and forming a spaced pile with top and bottom ends;
• a fluid conduit disposed at an end of the spaced pile of overhanging edge portions;
• and
• a plurality of heat pads of highly thermally conductive material disposed between and in thermal contact with said overhanging heat transfer wafer edge portions, the thickness of heat pad material lying between a pair of said wafers which have adjacent but spaced overhanging edge portions being of substantially the same thickness as the space between said pair of wafers in said stack.

A high density arrangement of integrated circuit devices comprising:

• a multiplicity of wafers arranged in a stack and electrically interconnected;
• a plurality of integrated circuit devices mounted on certain of said wafers;
• PG,22
• said wafers including a plurality of heat transfer wafers formed primarily of highly thermally conductive material, being closely thermally coupled to corresponding circuit devices, and having overhanging edge portions at a predetermined side of the stack;
• a fluid conduit secured relative to said stack and extending along said predetermined side of said stack;
• first clamp means clamping said wafers into a tight stack at a location spaced from said overhanging edge portions;
• and
• second clamp means clamping said fluid conduit to said overhanging heat transfer wafer edge portion in close thermal coupling therewith independently of said first clamp means.