Electronic package module
AssigneeAcer Incorporated
InventorsYu-Shih Wang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
Life of this patent
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Abstract
The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.
Claims11
An electronic package module, comprising:
- a chip;
- a heat-dissipation component;
- a carrying member clamped between the chip and the heat-dissipation component, wherein the carrying member has a porous structure;
- and
- a liquid metal filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component, wherein the liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component, wherein the carrying member comprises a metal mesh, a compressible elastic body, and an outer frame, the metal mesh has the porous structure, the compressible elastic body is disposed surrounding a periphery of the metal mesh and compressed between the heat-dissipation component and the chip, and the outer frame is disposed surrounding a periphery of the compressible elastic body, wherein a thickness of the compressible elastic body is greater than a thickness of the metal mesh, and the thickness of the compressible elastic body is greater than a thickness of the outer frame.
Dependencies are inferred from the claim text.