Wiring board
AssigneeDai Nippon Printing Co., Ltd.
InventorsHiroki Furushou, Atsuko Chigira, Toshio Sasao, Hiroshi Mawatari
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Abstract
A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.
Claims14
A wiring board comprising:
- a substrate having a through hole and including a first element;
- and
- at least one wiring extending from a top surface to a bottom surface of the substrate through the through hole and comprising:
- a diffusion layer in contact with the substrate and containing a first metal element;
- and
- a first metal film over and in contact with the diffusion layer, the first metal film being spaced away from the substrate and containing a second metal element,
- wherein the diffusion layer has a region containing the first element and the first metal element and a region containing the first metal element and the second metal element.
Dependencies are inferred from the claim text.