H10W 40/641
Snap-on arrangements
Official title: {Snap-on arrangements, e.g. clips}
H10W40/641 (Snap-on arrangements) appears on 1,509 US grants and 1,231 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,509
- Published applications
- 1,231
- Assignees
- 481
- Inventors
- 2,454
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 7 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 8 | 0 |
| 1990 | 11 | 0 |
| 1991 | 7 | 0 |
| 1992 | 10 | 0 |
| 1993 | 8 | 0 |
| 1994 | 26 | 0 |
| 1995 | 25 | 0 |
| 1996 | 25 | 0 |
| 1997 | 22 | 0 |
| 1998 | 39 | 0 |
| 1999 | 49 | 0 |
| 2000 | 50 | 0 |
| 2001 | 84 | 16 |
| 2002 | 110 | 43 |
| 2003 | 72 | 65 |
| 2004 | 74 | 79 |
| 2005 | 51 | 83 |
| 2006 | 55 | 58 |
| 2007 | 68 | 89 |
| 2008 | 69 | 93 |
| 2009 | 59 | 84 |
| 2010 | 71 | 73 |
| 2011 | 46 | 60 |
| 2012 | 25 | 22 |
| 2013 | 24 | 45 |
| 2014 | 29 | 38 |
| 2015 | 26 | 31 |
| 2016 | 26 | 28 |
| 2017 | 23 | 20 |
| 2018 | 36 | 33 |
| 2019 | 25 | 31 |
| 2020 | 35 | 38 |
| 2021 | 22 | 29 |
| 2022 | 23 | 23 |
| 2023 | 22 | 33 |
| 2024 | 24 | 79 |
| 2025 | 54 | 18 |
| 2026 | 25 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Liquid cooled cold plate for multiple semiconductor chip packages18 Aug 2026US 12,713,555 B2Intel Corporation
- Integrated separator devices for hardware component separation4 Aug 2026US 12,701,666 B2Intel Corporation
- Heat spreader assembly for use with a semiconductor device4 Aug 2026US 12,701,998 B2
- Computer housing10 Sep 2026US 2026/0267380 A1Apple Inc.
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
- Methods and apparatus to protect integrated circuit packages and their interconnects from shock loads30 Jul 2026US 2026/0223671 A1Intel Corporation
- Electric Circuit Body, Power Conversion Device, and Method for Manufacturing Electric Circuit Body30 Jul 2026US 2026/0223723 A1Astemo, Ltd.
- Methods and apparatus to apply load to a socketed integrated circuit package independent of a heatsink loading mechanism23 Jul 2026US 2026/0214805 A1Intel Corporation
Most cited
By later US patents
- Apparatus and method for direct attachment of heat sink to surface mount159US 6,178,628 B2Aavid Thermalloy, LLC · 2001
- Multiple-fan microprocessor cooling through a finned heat pipe153US 5,339,214 AIntel Corporation · 1994
- Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink141US 6,349,035 B1Compaq Information Technologies Group, L.P. · 2002
- EMI shield, and assembly using same133US 5,357,404 AThe Whitaker Corporation · 1994
- Electronic chip-carrier heat sinks129US 4,679,118 AAavid Engineering, Inc. · 1987