Heat spreader assembly for use with a semiconductor device

A semiconductor assembly, comprising:

• a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate;
• and
• a heat spreader assembly mounted with the semiconductor device, comprising:
• a pair of locking bars mounted on the substrate of the semiconductor device and at two opposite sides of the at least one semiconductor die, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot extending along the locking bar;
• and
• a heat spreader comprising:
• a heat spreader body comprising a top portion and a pair of lateral portions extending from the top portion, the heat spreader body defining a space for receiving the at least one semiconductor die;
• and
• a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively, wherein the pair of protrusion ribs is configured to, when the heat spreader body is pushed towards the substrate, slide past the locking hooks of the pair of locking bars and be engaged within the slots to prevent the heat spreader from moving away from the substrate of the semiconductor device.

A method for making a semiconductor assembly, comprising:

• providing a semiconductor device, wherein the semiconductor device comprises a substrate and at least one semiconductor die mounted on the substrate;
• providing a pair of locking bars, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot extending along the locking bar;
• providing a heat spreader comprising:
• a heat spreader body comprising a top portion and a pair of lateral portions extending from the top portion, the heat spreader body defining a space for receiving the at least one semiconductor die;
• and
• a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively;
• mounting the pair of locking bars on the substrate of the semiconductor device and at two opposite sides of the at least one semiconductor die;
• and
• engaging the heat spreader with the substrate by pushing the heat spreader body towards the substrate and engaging the pair of protrusion ribs within the locking hooks of the pair of locking bars.