US 5,357,404 A · EMI shield, and assembly using same

Abstract

The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The shield is a metal frame extending around the socket and package, and secured to it by locking tabs extending inwardly from the frame to detents on the edges of the socket. The socket contains double-wall structures spaced along its periphery which support the frame when it is on the socket, and the heat sink is provided with depending skirts which extend downwardly on all sides of the socket and package, to contribute additional EMI shielding. The sink is held to the socket by resilient retainers, each secured at one end to an upper surface of the heat sink and extending downwardly through the heat sink to be releasably secured to latching detents on the edges of the socket, by means of latches located inside the frame. The double-wall structures hold the frame outward from the latching detents sufficiently that the latches of the retainer fit between the edges of the socket and the inside of the frame.

Claims13

Dependent claims

A socket having openings for receiving electrical leads of an electronic package to be mounted thereon, and adapted to receive and be secured to an electromagnetic shielding device including an electrically-conductive frame, said socket comprising:

an integral socket body having a central portion defining said openings;
said socket having double-wall structures at spaced apart intervals around a periphery thereof, said double-wall structures having inner and outer walls defining downwardly-open slots adapted to receive said frame therein;
outer surfaces of the inner walls defining detents cooperable with resilient locking tabs of said frame to secure said frame to said socket;
peripheral regions of said socket between said double-wall structures defining respective latching detents each for receiving a latch of a heat-sink retainer placed over said electronic package;
said socket being dimensioned such that said double-wall structures hold said frame at a distance from said latching detents sufficient to permit insertion of each said latch between said frame and its respective said latching detent.

2 more elements

An electronic package assembly, comprising:

an electronic package having electrical leads extending therefrom and communicating electrically with the contents of said package;
a socket receiving said leads and holding said package on said socket;
a shielding device comprising an electrically-conductive frame surrounding peripheral portions of said socket and secured thereto, to minimize electromagnetic emissions from said assembly;
an electrically-conductive heat sink overlying said package for dissipating heat generated within said package;
and
retainer means extending from said sink to said socket and having releasable latch means securing one end of said retainer means to said socket;
said heat sink having a depending skirt extending downward therefrom and completely surrounding said socket outside of said shielding device;
said frame having means for electrically connecting with a ground circuit, and having electrically-conductive tabs extending outwardly from said frame and in contact with said skirt;
said retainer means extending from said sink downward, inside said frame and said heat-sink skirt, to at least one position on said socket inside of said frame;
and
detent means on said socket at said at least one position inside said frame, securing said latch means to said socket;
whereby said socket and said package are shielded on all sides.

9 more elements

Dependencies are inferred from the claim text.

EMI shield, and assembly using same

Life of this patent

EMI shield, and assembly using same

Life of this patent

Abstract

Claims13