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US 5,339,214 AGranted
Multiple-fan microprocessor cooling through a finned heat pipe
AssigneeIntel Corporation
InventorDaryl Nelson
Life of this patent
Estimating the term…
Abstract
A computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units. The heat pipe provides a computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.
Claims8
A computer assembly, comprising:
- a chassis having a baseplate and a back wall;
- a first fan attached to said back wall;
- a second fan attached to said back wall;
- a heat sink that is coupled to said chassis adjacent to said first and second fans;
- a first electronic package coupled to said baseplate and separated from said first and second fans by said heat sink, said first electronic package being capable of generating head;
- and,
- a heat pipe coupled to said first electronic package and said heat sink, said heat pipe being adapted to transfer heat from said first electronic package to said heat sink.
4 more elements
A computer assembly, comprising:
- a chassis having a baseplate and a back wall;
- a first fan attached to said back wall, said first fan being adapted to generate a stream of air;
- a heat sink that is coupled to said chassis and has a plurality of fins that are adjacent to said first fan such that said stream of air flows across said fins;
- a mounting plated coupled to said chassis, said mounting plate having a first side and an opposite second side;
- a first electronic package mounted to said first side of said mounting plate, said first electronic package being capable of generating heat;
- a heat pipe mounted to said second side of said mounting plate, said heat pipe being adapted to transfer heat from said first electronic package to said heat sink.
3 more elements
Dependencies are inferred from the claim text.