H10W 40/80
Circuit arrangements for thermal protection or control of packages
H10W40/80 (Circuit arrangements for thermal protection or control of packages) appears on 0 US grants and 4 published applications in this corpus.
Search patents in H10W- Granted patents
- 0
- Published applications
- 4
- Assignees
- 6
- Inventors
- 17
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2025 | 0 | 1 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Semiconductor package with stacked members8 Oct 2026US 2026/0314415 A1Samsung Electronics Co., Ltd.
- Semiconductor device and switching circuit13 Aug 2026US 2026/0239984 A1Ancora Semiconductors Inc.
- Heat dissipation structure for semiconductor package module and electronic device including the same23 Jul 2026US 2026/0215275 A1Unick Corporation
- Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissipation Ceramic Substrates and Manufacturing method of the Same24 Apr 2025US 2025/0132233 A1ICP Technology Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.