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US 2026/0239984 A1Published application
Semiconductor device and switching circuit
AssigneesRohm Co., Ltd., Ancora Semiconductors Inc.
InventorsTakumi FUJIMAKI, Satoru NATE, Ying-Chen LIU, Wei-Hsiang CHAO
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Abstract
A semiconductor device includes a GaN chip and a Si chip. The GaN chip includes a GaN power element and a temperature monitoring element. The Si chip includes: a drive circuit configured to drive the GaN power element; and a protection circuit configured to generate a thermal shutdown protection signal using an output of the temperature monitoring element.
Claims14
A semiconductor device comprising:
- a GaN chip;
- and
- a Si chip,
- wherein the GaN chip includes:
- a GaN power element;
- and
- a temperature monitoring element, and
- the Si chip includes:
- a drive circuit configured to drive the GaN power element;
- and
- a protection circuit configured to generate a thermal shutdown protection signal using an output of the temperature monitoring element.
8 more elements
Dependencies are inferred from the claim text.