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US 12,757,354 B2Granted
Modular vapor chamber and connection of segments of modular vapor chamber
AssigneeIntel Corporation
InventorsFeroze Khan, Arnab Sen, Jeff Ku, Samarth Alva
Life of this patent
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Abstract
Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.
Claims20
An electronic device comprising:
- a first heat source;
- a second heat source;
- and
- a modular vapor chamber, wherein the module vapor chamber includes:
- a first vapor chamber segment over the first heat source;
- a second vapor chamber segment over the second heat source, wherein a gap is between the first vapor chamber segment and the second vapor chamber segment;
- and
- a vapor chamber coupling located in the gap to thermally couple the first vapor chamber segment and the second vapor chamber segment, wherein the vapor chamber coupling includes a first vapor chamber extension extending from the first vapor chamber segment and a second vapor chamber extension extending from the second vapor chamber segment, and an extension coupling that thermally couples the first vapor chamber extension to the second vapor chamber extension.
5 more elements
A modular vapor chamber system comprising:
- a first vapor chamber segment having a first profile;
- a second vapor chamber segment, wherein the second vapor chamber segment has a second profile that is different than the first profile of the first vapor chamber segment;
- a third vapor chamber segment, wherein the third vapor chamber segment has a third profile that allows the third vapor chamber segment to function as a pedestal or a gap pad;
- a fourth vapor chamber segment, wherein the fourth vapor chamber segment has a profile that is different than the first profile of the first vapor chamber segment, the second profile of the second vapor chamber segment, and the third profile of the third vapor chamber segment;
- and
- a vapor chamber coupling to thermally couple at least two of the first vapor chamber segment, the second vapor chamber segment, the third vapor chamber segment, and the fourth vapor chamber segment, wherein the vapor chamber coupling includes a first vapor chamber extension extending from the first vapor chamber segment and a second vapor chamber extension extending from the second vapor chamber segment, and an extension coupling that thermally couples the first vapor chamber extension to the second vapor chamber extension.
3 more elements
A method comprising:
- determining a board layout for an electronic device and identifying one or more heat sources;
- creating a modular vapor chamber using two or more pre made vapor chamber segments;
- and
- thermally coupling the two or more pre made vapor chamber segments together to create the modular vapor chamber, wherein thermally coupling the two or more pre made vapor chamber segments includes coupling a first vapor chamber extension extending from a first pre made vapor chamber segment to a second vapor chamber extension extending from a second pre made vapor chamber segment, wherein the first vapor chamber extension is thermally coupled to the second vapor chamber extension using an extension coupling.
1 more element
Dependencies are inferred from the claim text.