H10W 40/10
Arrangements for heating
H10W40/10 (Arrangements for heating) appears on 3,875 US grants and 4,893 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,875
- Published applications
- 4,893
- Assignees
- 1,083
- Inventors
- 8,412
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 4 | 0 |
| 1978 | 8 | 0 |
| 1979 | 8 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 8 | 0 |
| 1984 | 2 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 8 | 0 |
| 1991 | 13 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 12 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 18 | 0 |
| 1999 | 27 | 0 |
| 2000 | 47 | 0 |
| 2001 | 45 | 20 |
| 2002 | 55 | 60 |
| 2003 | 57 | 84 |
| 2004 | 75 | 114 |
| 2005 | 81 | 123 |
| 2006 | 84 | 138 |
| 2007 | 86 | 97 |
| 2008 | 66 | 70 |
| 2009 | 55 | 53 |
| 2010 | 46 | 65 |
| 2011 | 69 | 90 |
| 2012 | 57 | 146 |
| 2013 | 92 | 221 |
| 2014 | 137 | 222 |
| 2015 | 207 | 214 |
| 2016 | 217 | 223 |
| 2017 | 182 | 211 |
| 2018 | 189 | 236 |
| 2019 | 236 | 285 |
| 2020 | 237 | 326 |
| 2021 | 232 | 331 |
| 2022 | 221 | 346 |
| 2023 | 251 | 352 |
| 2024 | 275 | 367 |
| 2025 | 246 | 343 |
| 2026 | 125 | 156 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package8 Sep 2026US 12,733,487 B2Samsung Electronics Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device8 Sep 2026US 12,733,515 B2STMicroelectronics S,r.l.
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Mold Conductive Via1 Oct 2026US 2026/0305389 A1STATS ChipPAC Pte. Ltd.
- Package-on-package design for improved memory interconnect and thermal management in semiconductor devices1 Oct 2026US 2026/0305404 A1QUALCOMM Incorporated
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Electrical interconnects for packages containing photonic integrated circuits1 Oct 2026US 2026/0305479 A1Sicily Merger Sub II, Inc.
Most cited
By later US patents
- Fan-out package structure and methods for forming the same595US 8,803,306 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Ball grid array package and process for manufacturing same407US 7,372,151 B1ASAT Ltd. · 2008
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994
- Chip size semiconductor packages with stacked dies338US 6,577,013 B1Amkor Technology, Inc. · 2003
- Thinned die integrated circuit package312US 6,841,413 B2Intel Corporation · 2005