Thinned die integrated circuit package
AssigneeIntel Corporation
InventorsCheng-Yi Liu, Johanna Swan
Life of this patent
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Abstract
A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
Claims30
A method of fabricating an integrated circuit package, comprising:
- mounting a thinned semiconductor die on a planar surface of a heat spreader, wherein mounting includes attaching said die to the heat spreader by metal to metal diffusion bonding.
A method of fabricating an integrated circuit package, comprising:
- mounting a thinned semiconductor die on a planar surface of a heat spreader;
- and
- forming at least one build-up layer over the die and heat spreader.
A method of fabricating an integrated circuit package, comprising:
- mounting a thinned semiconductor die on a planar surface of a heat spreader;
- and
- forming a metallization layer on said die.
A method of fabricating an integrated circuit package, comprising:
- providing a planar heat spreader;
- mounting a plurality of thinned semiconductor dice on to a planar surface of said heat spreader to form a plurality of conjoined microelectronic packages;
- and
- singulating said plurality of conjoined microelectronic packages.
A method of fabricating an integrated circuit package, comprising:
- mounting a thinned semiconductor die on a planar surface of a heat spreader, wherein the thinned semiconductor die has a thickness of no more than 100 μm, and wherein mounting includes:
- depositing a metallization layer on a back surface of the die.
Dependencies are inferred from the claim text.