Semiconductor device and method of forming an antenna-in-package structure

A semiconductor device, comprising:

• a substrate including an antenna formed in or on a first area of the substrate, wherein the first area of the substrate has a first thickness greater than a second thickness of a second area of the substrate;
• a first electrical component disposed over the second area of the substrate;
• a second electrical component disposed over the first electrical component;
• and
• a first encapsulant disposed over the antenna.

A method of making a semiconductor device, comprising:

• providing a substrate including an antenna formed in a first area of the substrate, wherein a thickness of the first area of the substrate is greater than a thickness of a second area of the substrate and also greater than a thickness of a third area of the substrate, and wherein the first area of the substrate is formed thicker than the second area and third area by successively forming upper conductive layers and upper insulating layers over the first area directly on lower conductive layers and lower insulating layers that extend over the first area, the second area, and the third area;
• disposing a first electrical component over a second area of the substrate;
• disposing a conductive pillar on the substrate adjacent to the first electrical component;
• disposing an interconnect structure over a third area of the substrate;
• depositing a first encapsulant over the first electrical component and interconnect structure;
• disposing a second electrical component on the conductive pillar and over the first electrical component;
• depositing a second encapsulant over the second electrical component;
• and
• disposing a third encapsulant over the antenna, wherein the third encapsulant includes a higher dielectric constant than the first encapsulant and second encapsulant.

A method of making a semiconductor device, comprising:

• providing a substrate including an antenna formed in or on a first area of the substrate, wherein the first area of the substrate has a first thickness greater than a second thickness of a second area of the substrate;
• disposing a first electrical component over the second area of the substrate;
• disposing a second electrical component over the first electrical component;
• and
• disposing a first encapsulant over the antenna.