Multi-layer metal stack for wire bonding

An electronic device comprising:

• a substrate;
• a die disposed on a first surface of the substrate, the die including contact pads embedded in an active surface of the die;
• a protective element disposed on one or more of the contact pads;
• interconnects disposed on one or more different contact pads of the contact pads;
• a dielectric layer disposed on the active surface of the die;
• a wire bond attached from the protective element to one or more other electronic components in the electronic device;
• a leadframe attached to the interconnects;
• and
• a mold compound formed over the die.

A method comprising:

• attaching a die to a first surface of a substrate, the die having an active surface and contact pads embedded in the active surface of the die;
• depositing a protective element on one or more of the contact pads;
• depositing a dielectric layer on the active surface of the die;
• depositing a seed layer on the dielectric layer;
• performing an etching process to remove the seed layer on unwanted portions of the dielectric layer;
• depositing interconnects to one or more different contact pads of the contact pads;
• attaching a leadframe to the interconnects;
• and
• forming a mold compound over the die.