Method of manufacturing semiconductor devices and corresponding semiconductor device

A method, comprising:

• arranging a semiconductor integrated circuit die on a first surface of a thermally conductive die pad of a lead frame, the thermally conductive die pad having a second surface opposite the first surface;
• molding an encapsulation of insulating material onto the thermally conductive die pad;
• wherein a bottom surface of the encapsulation and the second surface of the thermally conductive die pad are coplanar;
• removing insulating material of the encapsulation from the bottom surface of the encapsulation at a borderline around the thermally conductive die pad to form a recessed portion of the encapsulation around the thermally conductive die pad;
• and
• filling the recessed portion with a thermally and electrically conductive material to augment a surface area of the thermally conductive die pad at the bottom surface of the encapsulation;
• wherein the thermally and electrically conductive material filling the recessed portion has a bottom surface coplanar with both the bottom surface of the encapsulation and the second surface of the thermally conductive die pad.