H10W 40/40
Involving heat exchange by flowing fluids
Official title: involving heat exchange by flowing fluids
H10W40/40 (Involving heat exchange by flowing fluids) appears on 6,213 US grants and 8,058 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,213
- Published applications
- 8,058
- Assignees
- 1,829
- Inventors
- 11,507
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 8 | 0 |
| 1978 | 14 | 0 |
| 1979 | 12 | 0 |
| 1980 | 8 | 0 |
| 1981 | 9 | 0 |
| 1982 | 5 | 0 |
| 1983 | 6 | 0 |
| 1984 | 11 | 0 |
| 1985 | 9 | 0 |
| 1986 | 12 | 0 |
| 1987 | 16 | 0 |
| 1988 | 20 | 0 |
| 1989 | 21 | 0 |
| 1990 | 31 | 0 |
| 1991 | 32 | 0 |
| 1992 | 28 | 0 |
| 1993 | 32 | 0 |
| 1994 | 48 | 0 |
| 1995 | 31 | 0 |
| 1996 | 54 | 0 |
| 1997 | 45 | 0 |
| 1998 | 73 | 0 |
| 1999 | 58 | 0 |
| 2000 | 84 | 0 |
| 2001 | 97 | 33 |
| 2002 | 145 | 128 |
| 2003 | 132 | 163 |
| 2004 | 148 | 237 |
| 2005 | 139 | 337 |
| 2006 | 213 | 362 |
| 2007 | 230 | 400 |
| 2008 | 203 | 353 |
| 2009 | 200 | 352 |
| 2010 | 213 | 356 |
| 2011 | 204 | 279 |
| 2012 | 162 | 282 |
| 2013 | 213 | 294 |
| 2014 | 186 | 291 |
| 2015 | 180 | 240 |
| 2016 | 243 | 294 |
| 2017 | 228 | 268 |
| 2018 | 256 | 290 |
| 2019 | 295 | 293 |
| 2020 | 265 | 347 |
| 2021 | 259 | 330 |
| 2022 | 258 | 376 |
| 2023 | 230 | 378 |
| 2024 | 305 | 500 |
| 2025 | 319 | 446 |
| 2026 | 218 | 429 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Arrangement for cooling and motor module6 Oct 2026US 12,757,731 B2Siemens Aktiengesellschaft
- Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector22 Sep 2026US 12,744,355 B2Transportation IP Holdings, LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Semiconductor device22 Sep 2026US 12,745,635 B2Fuji Electric Co., Ltd.
- Unit8 Oct 2026US 2026/0314411 A1JATCO Ltd
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package and cooling system thereof8 Oct 2026US 2026/0314414 A1Samsung Electronics Co., Ltd.
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
Most cited
By later US patents
- Apparatus for absorbing and dissipating excess heat generated by a system553US 7,593,230 B2Sensys Medical, Inc. · 2009
- Heat sink for cooling a heat producing element and application411US 5,504,650 AFujitsu Limited · 1996
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Integrated micro-channels for 3D through silicon architectures270US 7,432,592 B2Intel Corporation · 2008