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US 7,432,592 B2Granted
Integrated micro-channels for 3D through silicon architectures
AssigneeIntel Corporation
InventorsWei Shi, Daoqiang Lu, Yiqun Bai, Qing A. Zhou, Jiangqi He
Life of this patent
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Abstract
Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
Claims9
An apparatus comprising:
- an integrated circuit die including a through via;
- and
- a substrate attached to the integrated circuit die, wherein the substrate includes a second through via and a substantially enclosed micro-channel to remove heat from the integrated circuit die, wherein the substrate comprises a first portion with a first opening and a second portion with a second opening, and wherein the micro-channel is formed by aligning the first opening with the second opening wherein the substrate is opposite an active surface of the integrated circuit die.
Dependencies are inferred from the claim text.