Back to results
US 2026/0304696 A1Published application
Immersion cooling system for integrated circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJen-Yuan Chang
Life of this patent
Estimating the term…
Abstract
Cooling systems for integrated circuit devices are provided. A cooling system according to the present disclosure includes a coolant tank containing a coolant, a cooling coil disposed within the coolant tank, a refrigerant circulating in the cooling coil, and a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank.
Claims20
A cooling system, comprising:
- a coolant tank containing a coolant;
- a cooling coil disposed within the coolant tank;
- a refrigerant circulating in the cooling coil;
- a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank;
- and
- a device package disposed within the coolant tank and comprising:
- a package substrate,
- an interposer over the package substrate,
- a plurality of integrated circuit (IC) chips mounted on the interposer, and
- a molding layer covering the plurality of IC chips and a portion of the interposer,
- wherein an external surface of the molding layer is coated with a non-adhesion coating.
8 more elements
A cooling system, comprising:
- a coolant tank containing a coolant;
- a cooling coil disposed within the coolant tank;
- a refrigerant circulating in the cooling coil;
- a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank;
- and
- a device package disposed within the coolant tank and comprising:
- a package substrate,
- an interposer over the package substrate,
- a plurality of integrated circuit (IC) chips mounted on the interposer, and
- a molding layer covering the plurality of IC chips and a portion of the interposer,
- wherein the coolant tank comprises a bottom surface,
- wherein a thickness of the molding layer measured from a top surface of the interposer decreases with a distance from the bottom surface of the coolant tank.
9 more elements
A cooling system, comprising:
- a coolant tank containing a coolant;
- a cooling coil disposed within the coolant tank;
- a refrigerant circulating in the cooling coil;
- a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank;
- and
- a device package disposed within the coolant tank and comprising:
- a package substrate,
- an interposer over the package substrate,
- a plurality of integrated circuit (IC) chips mounted on the interposer, and
- a molding layer covering the plurality of IC chips and a portion of the interposer,
- wherein the coolant tank comprises a bottom surface,
- wherein the molding layer comprises a first thickness away from the bottom surface and a second thickness adjacent the bottom surface,
- wherein the first thickness is between about 300 µm and about 400 µm,
- wherein the second thickness is between about 350 µm and about 500 µm.
11 more elements
Dependencies are inferred from the claim text.