H10W 40/47
By flowing liquids
Official title: by flowing liquids, e.g. forced water cooling
H10W40/47 (By flowing liquids) appears on 3,944 US grants and 5,288 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,944
- Published applications
- 5,288
- Assignees
- 1,308
- Inventors
- 7,840
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 8 | 0 |
| 1978 | 13 | 0 |
| 1979 | 12 | 0 |
| 1980 | 8 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 10 | 0 |
| 1987 | 13 | 0 |
| 1988 | 11 | 0 |
| 1989 | 15 | 0 |
| 1990 | 24 | 0 |
| 1991 | 22 | 0 |
| 1992 | 20 | 0 |
| 1993 | 23 | 0 |
| 1994 | 28 | 0 |
| 1995 | 15 | 0 |
| 1996 | 19 | 0 |
| 1997 | 14 | 0 |
| 1998 | 29 | 0 |
| 1999 | 21 | 0 |
| 2000 | 31 | 0 |
| 2001 | 34 | 13 |
| 2002 | 44 | 53 |
| 2003 | 57 | 70 |
| 2004 | 48 | 91 |
| 2005 | 52 | 181 |
| 2006 | 116 | 184 |
| 2007 | 120 | 195 |
| 2008 | 79 | 169 |
| 2009 | 101 | 157 |
| 2010 | 105 | 143 |
| 2011 | 110 | 122 |
| 2012 | 73 | 175 |
| 2013 | 124 | 172 |
| 2014 | 128 | 198 |
| 2015 | 128 | 172 |
| 2016 | 188 | 226 |
| 2017 | 168 | 199 |
| 2018 | 179 | 217 |
| 2019 | 228 | 233 |
| 2020 | 205 | 283 |
| 2021 | 204 | 261 |
| 2022 | 204 | 299 |
| 2023 | 180 | 305 |
| 2024 | 252 | 432 |
| 2025 | 269 | 375 |
| 2026 | 179 | 363 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Semiconductor device22 Sep 2026US 12,745,635 B2Fuji Electric Co., Ltd.
- Liquid cooled compact power systems22 Sep 2026US 12,745,636 B2Marel Power Solutions, Inc.
- Power semiconductor module and manufacturing method thereof22 Sep 2026US 12,745,637 B2Huawei Digital Power Technologies Co., Ltd.
- Unit8 Oct 2026US 2026/0314411 A1JATCO Ltd
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package and cooling system thereof8 Oct 2026US 2026/0314414 A1Samsung Electronics Co., Ltd.
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Structures and processes for attaching cold plates to multi chip modules1 Oct 2026US 2026/0305336 A1
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Integrated micro-channels for 3D through silicon architectures270US 7,432,592 B2Intel Corporation · 2008
- Cooling method for silicon on insulator devices246US 6,242,778 B1International Business Machines Corporation · 2001
- Semiconductor interposer integration241US 9,893,004 B2BroadPak Corporation · 2018