H10W 40/475
Using jet impingement
Official title: {using jet impingement (H10W40/776 takes precedence)}
H10W40/475 (Using jet impingement) appears on 391 US grants and 526 published applications in this corpus.
Search patents in H10W- Granted patents
- 391
- Published applications
- 526
- Assignees
- 184
- Inventors
- 756
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 9 | 14 |
| 2003 | 13 | 8 |
| 2004 | 4 | 10 |
| 2005 | 6 | 9 |
| 2006 | 12 | 21 |
| 2007 | 13 | 16 |
| 2008 | 9 | 18 |
| 2009 | 18 | 19 |
| 2010 | 12 | 16 |
| 2011 | 17 | 5 |
| 2012 | 10 | 15 |
| 2013 | 8 | 5 |
| 2014 | 9 | 19 |
| 2015 | 10 | 13 |
| 2016 | 15 | 11 |
| 2017 | 5 | 16 |
| 2018 | 12 | 11 |
| 2019 | 21 | 11 |
| 2020 | 19 | 33 |
| 2021 | 16 | 26 |
| 2022 | 20 | 23 |
| 2023 | 23 | 29 |
| 2024 | 26 | 29 |
| 2025 | 29 | 35 |
| 2026 | 14 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Piezoelectric MEMS-based active cooling for heat dissipation in compute devices22 Sep 2026US 12,745,638 B2Frore Systems Inc.
- Wafer-scale integration with a stiffening isometric grid array25 Aug 2026US 12,721,244 B2Volantis Semiconductor, Inc.
- Jet impingement cooling devices, systems, and methods4 Aug 2026US 12,701,671 B2Colorado State University Research Foundation
- Driving of piezoelectrics for MEMS-based cooling systems19 May 2026US 12,635,413 B2Frore Systems Inc.
- Cooling component including supply ports and discharge ports5 May 2026US 12,621,958 B2NEC Platforms, Ltd.
- System and method for cooling an electronic device10 Sep 2026US 2026/0271722 A1Impact Cooling Inc.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Thermal management of gpu-hbm package by microchannel integrated substrate6 Aug 2026US 2026/0231767 A1Micron Technology, Inc.
- Power semiconductor module23 Jul 2026US 2026/0215273 A1Dynex Semiconductor Limited
Most cited
By later US patents
- Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack154US 6,973,801 B1International Business Machines Corporation · 2005
- Liquid cooling system for LSI packages137US 5,522,452 ANEC Corporation · 1996
- Apparatus for cooling heat generating members125US 5,349,831 AHitachi, Ltd. · 1994
- Method and two-phase spray cooling apparatus125US 6,498,725 B2Mainstream Engineering Corporation · 2002
- Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device123US 7,000,684 B2Cooligy, Inc. · 2006