Liquid cooling system for LSI packages
AssigneeNEC Corporation
InventorsTsukasa Mizuno, Hirokazu Miyazaki, Kazuhiko Umezawa
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AssigneeNEC Corporation
InventorsTsukasa Mizuno, Hirokazu Miyazaki, Kazuhiko Umezawa
Estimating the term…
In a liquid cooling system for a printed circuit board on which integrated circuit packages are mounted, heat sinks are secured respectively to the packages in heat transfer contact therewith. Nozzles are provided in positions corresponding to the heat sinks. A housing is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump pressurizes working liquid cooled by a heat exchanger and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump is connected to an outlet of the housing for draining liquid coolant to the heat exchanger and a vapor suction pump is connected to a second outlet of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working fluid.
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
A liquid cooling system comprising:
Dependencies are inferred from the claim text.