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US 2026/0231767 A1Published application
Thermal management of gpu-hbm package by microchannel integrated substrate
AssigneeMicron Technology, Inc.
InventorsXiaopeng Qu, Hyunsuk Chun, Eiichi Nakano
Life of this patent
Estimating the term…
Abstract
Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. The microchannel can be configured beneath the memory device and/or the logic device.
Claims20
(canceled)
An interposer comprising:
- a substrate material including:
- a first major surface with a first mounting site for receiving a first semiconductor device and a second mounting site for receiving a second semiconductor device, and
- a second major surface opposite the first major surface;
- a first inlet at the first major surface outside of the first and second mounting sites and configured to receive a coolant;
- a first microchannel coupled to the first inlet and configured to permit the coolant to flow between the first major surface and the second major surface;
- a first outlet coupled to the first microchannel at the first major surface within the first mounting site and configured to output the coolant to the first semiconductor device;
- a second inlet at the first major surface within the first mounting site and configured to receive the coolant from the first semiconductor device;
- a second microchannel coupled to the second inlet and configured to permit the coolant to flow between the first major surface and the second major surface;
- and
- a second outlet coupled to the second microchannel at the first major surface outside of the first and second mounting sites and configured to output the coolant.
7 more elements
A semiconductor device assembly comprising:
- a first semiconductor device;
- a second semiconductor device;
- and
- an interposer including:
- a substrate material having:
- a first major surface with a first mounting site at which the first semiconductor device is mounted and a second mounting site at which the second semiconductor device is mounted, and
- a second major surface opposite the first major surface;
- a first inlet at the first major surface outside of the first and second mounting sites and configured to receive a coolant;
- a first microchannel coupled to the first inlet and configured to permit the coolant to flow between the first major surface and the second major surface;
- a first outlet coupled to the first microchannel at the first major surface within the first mounting site and configured to output the coolant to an inlet of the first semiconductor device;
- a second inlet at the first major surface within the first mounting site and configured to receive the coolant from an outlet of the first semiconductor device;
- a second microchannel coupled to the second inlet and configured to permit the coolant to flow between the first major surface and the second major surface;
- and
- a second outlet coupled to the second microchannel at the first major surface outside of the first and second mounting sites and configured to output the coolant.
11 more elements
A method of forming a semiconductor device assembly, comprising:
- providing an interposer including:
- a substrate material having:
- a first major surface with a first mounting site for receiving a first semiconductor device and a second mounting site for receiving a second semiconductor device, and
- a second major surface opposite the first major surface,
- a first inlet at the first major surface outside of the first and second mounting sites and configured to receive a coolant,
- a first microchannel coupled to the first inlet and configured to permit the coolant to flow between the first major surface and the second major surface,
- a first outlet coupled to the first microchannel at the first major surface within the first mounting site and configured to output the coolant to the first semiconductor device,
- a second inlet at the first major surface within the first mounting site and configured to receive the coolant from the first semiconductor device,
- a second microchannel coupled to the second inlet and configured to permit the coolant to flow between the first major surface and the second major surface;
- an,
- a second outlet coupled to the second microchannel at the first major surface outside of the first and second mounting sites and configured to output the coolant;
- mounting the second semiconductor device to the second mounting site;
- and
- mounting the first semiconductor device to the first mounting site, wherein the first semiconductor device includes a coolant path between the inlet of the first semiconductor device and the outlet of the semiconductor device, such that mounting the first semiconductor device to the interposer provides a continuous coolant path between the first inlet and the second outlet.
11 more elements
Dependencies are inferred from the claim text.