Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

A heat exchanger configured to cool a heat source comprising:

• a. an interface layer in contact with the heat source and configured to pass fluid therethrough, wherein the interface layer includes a porous microstructure disposed thereon;
• and
• b. a manifold layer coupled to the interface layer, the manifold layer further comprising:
• i. a first level having a plurality of substantially vertical inlet paths for delivering fluid to the interface layer, wherein the inlet paths are arranged an optimal fluid travel distance from one another other;
• and
• ii. a second level having at least one outlet path for removing fluid from the interface layer.

A manifold layer adapted to be coupleable to an interface layer to form a microchannel heat exchanger comprising:

• a. an inlet port for providing a first temperature fluid;
• b. an inlet fluid path in communication with the inlet port, the inlet fluid path adapted for channeling first temperature fluid to the interface layer, wherein the interface layer includes a porous microstructure disposed thereon;
• c. an outlet fluid path adapted for removing a second temperature fluid from the interface layer, wherein the first temperature fluid and the second temperature fluid are kept separate in the manifold layer;
• d. an outlet port in communication with the outlet fluid path, wherein the second temperature fluid exits the manifold layer via the outlet port;
• and
• e. a third layer having a series of substantially vertical inlet passages for channeling the first temperature fluid and a series of substantially vertical outlet passages for channeling the second temperature fluid, each inlet passage in communication with the inlet flow path and each outlet passage in communication with the outlet flow path, wherein each inlet and outlet passage is arranged to minimize pressure drop therebetween and wherein the inlet and outlet passages are arranged in a non-uniform manner along at least one dimension of the third layer.

A method of manufacturing a heat exchanger configured to cool a heat source, the method comprising the steps of:

• a. forming an interface layer configurable to be in contact with the heat source to pass fluid therethrough, wherein the interface layer includes a micro-porous microstructure disposed thereon;
• b. forming a manifold layer to include at least one inlet fluid path and at least one outlet fluid path, the at least one inlet fluid path and the at least one outlet fluid path arranged to channel fluid flow an optimal minimum distance therebetween along the interface layer;
• and
• c. coupling the manifold layer to the interface layer.

An electronic device which produces heat comprising:

• a. an integrated circuit;
• b. an interface layer for cooling heat produced by the electronic device, the interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough, wherein the interface layer includes a porous microstructure disposed thereon;
• and
• c. a manifold layer for circulating fluid with the interface layer, the manifold layer having at least one inlet fluid path for delivering fluid to the interface layer and at least one outlet fluid path for removing fluid from the interface layer, the at least one inlet fluid path and the at least one outlet fluid path arranged to provide an optimal minimum fluid travel distance apart from each other.