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US 2026/0305336 A1Published application
Structures and processes for attaching cold plates to multi chip modules
OwnerGaius Gillman Fountain, JR., Pawel Mrozek +4inventors
InventorsGaius Gillman Fountain, JR., Pawel Mrozek, Kushal Rijal, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar
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Abstract
A device package comprising an integrated cooling assembly and method of forming the same. The device package comprises a multi-chip module (MCM) comprising chips attached to a substrate, and at least one silicon preform disposed adjacent to the MCM. A cold plate is attached to the chips and at least one silicon preform.
Claims20
An integrated cooling assembly comprising:
- a substrate;
- a plurality of chips attached to the substrate;
- at least one silicon preform adjacent to the plurality of chips and attached to the substrate;
- and
- a cold plate attached to the plurality of chips and the at least one silicon preform.
2 more elements
A method comprising:
- attaching a silicon preform to a substrate comprising a plurality of chips disposed in a molding material, wherein the silicon preform surrounds the plurality of chips;
- backgrinding the chips, the silicon preform, and the molding material to form a planar surface;
- polishing the chips and the silicon preform using a hard pad;
- recessing the molding material below a surface of the chips and the at least one silicon preform;
- polishing the chips and the silicon preform using a soft pad;
- and
- bonding a cold plate to the plurality of chips and the silicon preform.
4 more elements
A method comprising:
- attaching at least one silicon preform to a substrate comprising groups of plurality of chips disposed in a molding material, wherein the at least one silicon preform is disposed in an area adjacent to at least one group of the plurality of chips;
- backgrinding the groups of the plurality of chips, the at least one silicon preform, and the molding material to form a planar surface;
- polishing the chips and the at least one silicon preform using a hard pad;
- recessing the molding material below a surface of the chips and the at least one silicon preform;
- polishing the chips and the at least one silicon preform using a soft pad;
- and
- bonding at least one cold plate to the at least one silicon preform and the respective group of the plurality of chips.
4 more elements
Dependencies are inferred from the claim text.