Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorSota Yamaguchi
Life of this patent
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Abstract
A semiconductor device includes a first semiconductor unit that includes a first substrate including a first wiring board to which a first semiconductor chip is bonded, a second semiconductor unit that includes a second substrate including a second wiring board to which a second semiconductor chip is bonded, a cooling unit including a first cooling surface and a second cooling surface that are opposite to each other and respectively have the first semiconductor unit facing the first substrate thereon and the second semiconductor unit facing the second substrate thereon, and an output terminal provided at a first side of the cooling unit and being connected to both the first wiring board and the second wiring board.
Claims13
A semiconductor device, comprising:
- a first semiconductor unit including a first semiconductor chip and a first substrate, the first substrate including, on a first main surface thereof, a first input wiring board, to which the first semiconductor chip is bonded, and a first output wiring board;
- a second semiconductor unit including a second semiconductor chip and a second substrate, the second substrate including, on a second main surface thereof, a second input wiring board, to which the second semiconductor chip is bonded, and a second output wiring board;
- a cooling unit having a first side in a plan view of the semiconductor device and including a first cooling surface and a second cooling surface that are opposite to each other and respectively have thereon the first semiconductor unit facing the first substrate and the second semiconductor unit facing the second substrate so that the cooling unit is sandwiched between the first and second semiconductor units;
- and
- an output terminal provided at the first side of the cooling unit and being connected to both the first output wiring board and the second input wiring board.
A semiconductor device, comprising:
- a first semiconductor unit including a first semiconductor chip and a first substrate, the first substrate including, on a first main surface thereof, a first wiring board to which the first semiconductor chip is bonded;
- a second semiconductor unit including a second semiconductor chip and a second substrate, the second substrate including, on a second main surface thereof, a second wiring board to which the second semiconductor chip is bonded;
- a cooling unit having a first side in a plan view of the semiconductor device and including a first cooling surface and a second cooling surface that are opposite to each other and respectively have thereon the first semiconductor unit facing the first substrate and the second semiconductor unit facing the second substrate so that the cooling unit is sandwiched between the first and second semiconductor units;
- and
- an output terminal provided at the first side of the cooling unit and being connected to both the first wiring board and the second wiring board, wherein
- the first semiconductor chip includes a first output electrode provided on a front surface thereof and a first input electrode provided on a rear surface thereof,
- the second semiconductor chip includes a second output electrode provided on a front surface thereof and a second input electrode provided on a rear surface thereof,
- the first wiring board includes first input wiring to which the rear surface of the first semiconductor chip is bonded and first output wiring that is adjacent to the first input wiring and is electrically connected to the first output electrode of the first semiconductor chip,
- the second wiring board includes second input wiring to which the rear surface of the second semiconductor chip is bonded and second output wiring that is adjacent to the second input wiring and is electrically connected to the second output electrode of the second semiconductor chip, and
- the output terminal connects the first input wiring to the second output wiring.
Dependencies are inferred from the claim text.