H10W 40/43
By flowing gases
Official title: by flowing gases, e.g. forced air cooling
H10W40/43 (By flowing gases) appears on 2,563 US grants and 3,222 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,563
- Published applications
- 3,222
- Assignees
- 912
- Inventors
- 4,940
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 9 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 10 | 0 |
| 1992 | 9 | 0 |
| 1993 | 14 | 0 |
| 1994 | 21 | 0 |
| 1995 | 16 | 0 |
| 1996 | 37 | 0 |
| 1997 | 33 | 0 |
| 1998 | 46 | 0 |
| 1999 | 38 | 0 |
| 2000 | 53 | 0 |
| 2001 | 65 | 20 |
| 2002 | 104 | 76 |
| 2003 | 78 | 98 |
| 2004 | 103 | 153 |
| 2005 | 89 | 161 |
| 2006 | 103 | 193 |
| 2007 | 116 | 221 |
| 2008 | 130 | 190 |
| 2009 | 106 | 210 |
| 2010 | 113 | 222 |
| 2011 | 98 | 168 |
| 2012 | 92 | 113 |
| 2013 | 92 | 141 |
| 2014 | 61 | 115 |
| 2015 | 65 | 86 |
| 2016 | 74 | 82 |
| 2017 | 73 | 99 |
| 2018 | 102 | 99 |
| 2019 | 86 | 72 |
| 2020 | 81 | 80 |
| 2021 | 61 | 79 |
| 2022 | 68 | 94 |
| 2023 | 61 | 76 |
| 2024 | 71 | 132 |
| 2025 | 99 | 86 |
| 2026 | 46 | 156 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Arrangement for cooling and motor module6 Oct 2026US 12,757,731 B2Siemens Aktiengesellschaft
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Inverter with closed cooling channel1 Sep 2026US 12,727,130 B2Viessmann Climate Solutions SE
- Refrigerant liquid-gas separator25 Aug 2026US 12,716,628 B2Bergstrom, Inc.
- Electronic assembly and semiconductor switching device18 Aug 2026US 12,713,514 B2Siemens Aktiengesellschaft
- Structures and processes for attaching cold plates to multi chip modules1 Oct 2026US 2026/0305336 A1
- 3d integrated chips with microfluidic cooling1 Oct 2026US 2026/0305344 A1Microsoft Technology Licensing, LLC
- Composite cooling disk for continuous transient cooling for semiconductor chip17 Sep 2026US 2026/0282909 A1Western Digital Technologies, Inc.
- Choked flow cooling3 Sep 2026US 2026/0262496 A1SK Hynix NAND Product Solutions Corp.
- Traction inverter component cooling27 Aug 2026US 2026/0255556 A1GM Global Technology Operations LLC
Most cited
By later US patents
- Apparatus for absorbing and dissipating excess heat generated by a system553US 7,593,230 B2Sensys Medical, Inc. · 2009
- Heat sink for cooling a heat producing element and application411US 5,504,650 AFujitsu Limited · 1996
- Stack module249US 5,883,426 ANEC Corporation · 1999
- Substrate for packaging a semiconductor device having particular terminal and bump structure229US 5,196,726 ASumitomo Electric Industries, Ltd. · 1993
- Heat exchange apparatus227US 6,019,165 A2000