Composite cooling disk for continuous transient cooling for semiconductor chip

A method for removing heat from a heat-generating device, the method comprising:

• moving a thermally conductive structure over a surface of a heat-generating device, wherein the structure comprises:
• a first portion closer to the heat-generating device and comprising a thermally conductive first material having a first density, and
• a second portion farther from the heat-generating device and comprising a second material having a second density less than the first density;
• and
• wherein the movement of the structure over the surface of the heat-generating device (i) encourages transfer of heat generated by the heat-generating device to the structure via a liquid positioned at least between the structure and the heat-generating device and (ii) physically moves the heat transferred to the structure away from the heat-generating device.

An electronics cooling system comprising:

• a thermally conductive structure configured for moving over a heat-emanating surface of a heat-generating chip comprising one or more electronic circuits, wherein the structure comprises:
• a first portion closer to the heat-generating chip and comprising copper having a first density, and
• a second portion farther from the heat-generating chip and comprising a second material having a second density less than the first density;
• a liquid metal in which the structure is submerged;
• an enclosure housing the structure and the liquid metal;
• and
• means, external to the enclosure, for dissipating the heat transferred to the structure from the heat-generating chip;
• wherein:
• movement of the structure over the heat-emanating surface of the heat-generating chip promotes transfer of heat generated by the heat-generating chip to the copper structure via the liquid metal and physically moves the heat transferred to the copper structure away from the heat-generating chip for further removal from within the enclosure by the means for dissipating, and
• a volume of the second material is configured such that the total weight of the structure approaches a buoyant force of the liquid metal.