3d integrated chips with microfluidic cooling

A processing component, comprising:

• a first die;
• a second die connected to the first die with a microfluidic volume positioned between the first die and the second die;
• a wicking heat spreader connected to the first die and positioned in the microfluidic volume between the first die and the second die, the wicking heat spreader including a plurality of horizontal channels and a plurality of vertical channels in fluid communication with the plurality of horizontal channels, the plurality of horizontal channels being configured to receive a liquid phase of a working fluid from a lateral side of the wicking heat spreader, and the plurality of vertical channels being configured to direct a vapor phase of the working fluid away from the first die to draw additional liquid phase of the working fluid into the plurality of horizontal channels;
• and
• at least one through-silicon via (TSV) extending through the wicking heat spreader and electrically connecting the first die to the second die.

A method of cooling a processing component, the method comprising:

• receiving a liquid phase of a working fluid in a horizontal channel of a wicking heat spreader connected to a first die, the wicking heat spreader including at least one through-silicon via (TSV) extending through the wicking heat spreader and electrically connected to the first die;
• transferring heat from the first die to the liquid phase of the working fluid in the wicking heat spreader to produce a vapor phase of the working fluid;
• flowing the vapor phase of the working fluid upward through a vertical channel of the wicking heat spreader, the vertical channel being fluidly connected to the horizontal channel;
• and
• drawing additional liquid phase of the working fluid into the horizontal channel based on flowing the vapor phase of the working fluid upward through the vertical channel.