Arrangement for cooling and motor module
AssigneeSiemens Aktiengesellschaft
InventorsLutz Namyslo, Thomas Schwinn, Roman Kögler
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Abstract
An arrangement for cooling semiconductor components includes a cooling body base with a component side and a structural element side opposite the component side, wherein the semiconductor components are arrangeable in succession in the flow direction of a cooling medium, the structural element side are configured to increase its surface area by structural elements, and the structural element side is configured such that a density of structural elements involved in the cooling increases in the flow direction with regard to cooling zones.
Claims16
An arrangement for cooling semiconductor components, the arrangement comprising:
- a cooling body base having a component side and a structural element side opposite the component side, the semiconductor components being arrangeable in succession in a flow direction of a cooling medium;
- and
- wherein the structural element side is structured so as to provide an enlarged surface thereof via structural elements;
- wherein molded parts arranged on the structural element side are provided to thermally insulate at least one part of the structural elements;
- and
- wherein the structural element side is configured such that a numerical density of actively cooling structural elements arranged along the flow direction of the cooling medium increases in the flow direction relative to cooling zones.
Dependencies are inferred from the claim text.