Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly

A device, comprising:

• a substrate;
• an interposer stacked on the substrate;
• a first integrated circuit (IC) and a second IC disposed side-by-side on the interposer;
• a lid structure attached to the substrate and capping the first IC, the second IC and the interposer;
• and
• a thermal interface material (TIM) having a laterally extending portion between the first IC and the lid structure, and between the second IC and the lid structure, wherein the TIM further has a protrusion portion protruding into the lid structure with respect to the laterally extending portion, and the protrusion portion overlaps a portion of the interposer between the first and second ICs.

A device, comprising:

• a substrate;
• a chip assembly disposed over the substrate and including an integrated circuit (IC);
• a thermal interface material (TIM) disposed over the chip assembly and extending down along a sidewall of the chip assembly;
• a lid structure attached to the substrate and having an inner surface coupled to the chip assembly through the TIM, wherein the lid structure includes a cavity located at the inner surface and exposing the TIM.