H10W 40/20
Arrangements for cooling
H10W40/20 (Arrangements for cooling) appears on 15,147 US grants and 19,852 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,147
- Published applications
- 19,852
- Assignees
- 3,133
- Inventors
- 26,657
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 15 | 0 |
| 1978 | 19 | 0 |
| 1979 | 10 | 0 |
| 1980 | 13 | 0 |
| 1981 | 19 | 0 |
| 1982 | 14 | 0 |
| 1983 | 20 | 0 |
| 1984 | 15 | 0 |
| 1985 | 19 | 0 |
| 1986 | 27 | 0 |
| 1987 | 39 | 0 |
| 1988 | 22 | 0 |
| 1989 | 35 | 0 |
| 1990 | 34 | 0 |
| 1991 | 70 | 0 |
| 1992 | 65 | 0 |
| 1993 | 72 | 0 |
| 1994 | 102 | 0 |
| 1995 | 86 | 0 |
| 1996 | 116 | 0 |
| 1997 | 136 | 0 |
| 1998 | 201 | 0 |
| 1999 | 185 | 0 |
| 2000 | 197 | 0 |
| 2001 | 226 | 76 |
| 2002 | 239 | 297 |
| 2003 | 260 | 321 |
| 2004 | 274 | 402 |
| 2005 | 230 | 429 |
| 2006 | 263 | 463 |
| 2007 | 287 | 524 |
| 2008 | 273 | 476 |
| 2009 | 259 | 500 |
| 2010 | 348 | 518 |
| 2011 | 317 | 481 |
| 2012 | 345 | 462 |
| 2013 | 378 | 550 |
| 2014 | 393 | 689 |
| 2015 | 522 | 755 |
| 2016 | 641 | 825 |
| 2017 | 678 | 864 |
| 2018 | 798 | 906 |
| 2019 | 850 | 1066 |
| 2020 | 853 | 1180 |
| 2021 | 885 | 1275 |
| 2022 | 855 | 1269 |
| 2023 | 890 | 1427 |
| 2024 | 974 | 1460 |
| 2025 | 945 | 1441 |
| 2026 | 620 | 1196 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for cooling high power devices6 Oct 2026US 12,756,154 B2Lawrence Livermore National Security, LLC
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Arrangement for cooling and motor module6 Oct 2026US 12,757,731 B2Siemens Aktiengesellschaft
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Heterogeneous packaging integration of photonic and electronic elements8 Oct 2026US 2026/0309942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Apparatus for absorbing and dissipating excess heat generated by a system553US 7,593,230 B2Sensys Medical, Inc. · 2009
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994