H10W 40/22
Characterised by their shape
Official title: characterised by their shape, e.g. having conical or cylindrical projections
H10W40/22 (Characterised by their shape) appears on 9,088 US grants and 12,006 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,088
- Published applications
- 12,006
- Assignees
- 2,093
- Inventors
- 16,963
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 7 | 0 |
| 1982 | 3 | 0 |
| 1983 | 8 | 0 |
| 1984 | 4 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 12 | 0 |
| 1988 | 7 | 0 |
| 1989 | 11 | 0 |
| 1990 | 18 | 0 |
| 1991 | 24 | 0 |
| 1992 | 20 | 0 |
| 1993 | 28 | 0 |
| 1994 | 41 | 0 |
| 1995 | 38 | 0 |
| 1996 | 65 | 0 |
| 1997 | 70 | 0 |
| 1998 | 116 | 0 |
| 1999 | 104 | 0 |
| 2000 | 108 | 0 |
| 2001 | 148 | 43 |
| 2002 | 139 | 162 |
| 2003 | 147 | 156 |
| 2004 | 148 | 219 |
| 2005 | 129 | 251 |
| 2006 | 156 | 260 |
| 2007 | 168 | 291 |
| 2008 | 153 | 255 |
| 2009 | 139 | 287 |
| 2010 | 200 | 287 |
| 2011 | 182 | 297 |
| 2012 | 199 | 263 |
| 2013 | 226 | 313 |
| 2014 | 214 | 367 |
| 2015 | 292 | 474 |
| 2016 | 408 | 518 |
| 2017 | 425 | 534 |
| 2018 | 532 | 593 |
| 2019 | 533 | 668 |
| 2020 | 555 | 770 |
| 2021 | 568 | 824 |
| 2022 | 568 | 793 |
| 2023 | 581 | 842 |
| 2024 | 607 | 897 |
| 2025 | 587 | 919 |
| 2026 | 365 | 723 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Arrangement for cooling and motor module6 Oct 2026US 12,757,731 B2Siemens Aktiengesellschaft
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Heterogeneous packaging integration of photonic and electronic elements8 Oct 2026US 2026/0309942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package8 Oct 2026US 2026/0314409 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Molded electronic package with compression structures319US 5,041,902 AMotorola, Inc. · 1991