Electronic devices and methods of manufacturing electronic devices

A method of making an electronic device, comprising:

• providing a heat spreader;
• providing a mold material around lateral sides of the heat spreader to form a molded heat spreader;
• providing an electronic component disposed over the molded heat spreader and coupled to a substrate;
• and
• providing an encapsulant between the electronic component and the molded heat spreader, and between the substrate and the molded heat spreader.

A method of making an electronic device, comprising:

• providing a first substrate comprising an electronic component coupled to the first substrate;
• providing an interposer over the first substrate and coupled to the first substrate by a metallic-core ball, the interposer defining a cavity with a second substrate disposed in the cavity;
• and
• providing an encapsulant around the metallic-core ball, around the electronic component, around the second substrate, and between the interposer and the second substrate.