Molded electronic package with compression structures

An electronic package comprising:

• an integrated circuit die having a plurality of bonding pads thereon;
• a heat sink having:
• a die support surface upon which the integrated circuit die is mounted;
• a heat dissipation surface opposite the die support surface;
• and
• at least one surface between the die support surface and the heat dissipation surface having adhesion promoting features thereon;
• a plurality of package leads having
• proximal ends electrically connected to the bonding pads of the integrated circuit die;
• and
• distal ends extending outside the package;
• a package body of insulative material enclosing the integrated circuit die, the proximal ends of the leads, and the adhesion promoting features, but leaving at least part of the heat dissipation surface exposed;
• and
• at least one compression structure means extending from the heat sink to a side of the package opposite the heat dissipation surface for forcing the heat sink against a mold member during the formation of the package body wherein the compression columns are not integral with either a die bond flag or the heat sink.