H10W 40/226
Characterised by projecting parts
Official title: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
H10W40/226 (Characterised by projecting parts) appears on 4,823 US grants and 6,500 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,823
- Published applications
- 6,500
- Assignees
- 1,507
- Inventors
- 10,420
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 11 | 0 |
| 1992 | 10 | 0 |
| 1993 | 13 | 0 |
| 1994 | 20 | 0 |
| 1995 | 22 | 0 |
| 1996 | 40 | 0 |
| 1997 | 48 | 0 |
| 1998 | 78 | 0 |
| 1999 | 65 | 0 |
| 2000 | 67 | 0 |
| 2001 | 103 | 36 |
| 2002 | 102 | 121 |
| 2003 | 104 | 107 |
| 2004 | 105 | 149 |
| 2005 | 90 | 164 |
| 2006 | 103 | 174 |
| 2007 | 104 | 181 |
| 2008 | 98 | 156 |
| 2009 | 91 | 191 |
| 2010 | 134 | 205 |
| 2011 | 113 | 200 |
| 2012 | 137 | 178 |
| 2013 | 133 | 211 |
| 2014 | 124 | 211 |
| 2015 | 162 | 233 |
| 2016 | 181 | 245 |
| 2017 | 212 | 241 |
| 2018 | 232 | 262 |
| 2019 | 228 | 295 |
| 2020 | 258 | 346 |
| 2021 | 281 | 381 |
| 2022 | 249 | 382 |
| 2023 | 282 | 441 |
| 2024 | 278 | 452 |
| 2025 | 316 | 516 |
| 2026 | 169 | 422 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Arrangement for cooling and motor module6 Oct 2026US 12,757,731 B2Siemens Aktiengesellschaft
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrical connector having contact elements with superelastic properties29 Sep 2026US 12,749,836 B2Amphenol Corporation
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Unit8 Oct 2026US 2026/0314411 A1JATCO Ltd
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device8 Oct 2026US 2026/0314474 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
Most cited
By later US patents
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014